Dismantling the heart of the LED display: a comparative analysis of the 5 major packaging technologies
One,LED Packaging Technologyevolutionary path
Under the industry trend of miniaturization and high-definition of display devices, LED packaging technology has experienced three major innovations: from early direct insertion DIP packaging to surface mount SMD technology, and then to the breakthrough COB integrated packaging. Especially COB (Chip on Board) technology by binding the LED chip directly on the substrate, realizing the breakthrough of the dot pitch reduced to 0.5mm, making 4K/8K ultra-high-definition display possible.
Comparative analysis of mainstream packaging solutions
- SMD 3-in-1 technology: Adopt red, green and blue chip independent packaging, with mature industry chain advantages, but there are defects such as easy oxidation of solder joints and poor protection.
- COB integrated packageTens of thousands of microchips are integrated and packaged on the PCB substrate through the fully automated solid state wire bonding process, with IP54 protection level.
- IMD Composite SolutionsInnovative combination of SMD and COB advantages with 4-in-1 modular design, balancing process yield and maintenance costs.
Third, the key process breakthrough direction
Current packaging technology focuses on three core breakthroughs: miniaturization process to compress the chip size to 50 micron level, thehuge transfersThe yield rate has been increased to 99.999%; the nano-scale fluorescent coating technology enhances the color gamut coverage to 110% NTSC; the new heat dissipation structure adopts Aluminum Nitride ceramic substrate, which reduces the thermal resistance coefficient by more than 40%.
IV. Application Scenario Technology Adaptation
Outdoor advertising screen preferred GOB package solution, its special potting process can withstand extreme weather; XR virtual shooting using flip-flop COB technology, to achieve 2500nit high brightness under the precise control of light; conference room scenarios are inclined to Micro LED glass-based solutions, 0.4mm ultra-thin body support touch integration.
V. Outlook for future technological development
Quantum dot color conversion technology is making breakthroughs at the laboratory stage, which can increase the color purity of blue light chips to over 95%. The application of third-generation semiconductor materials such as gallium nitride has reduced the pixel drive current to the microampere level. The industry forecasts that by 2026, the market share of COB packaging will exceed 60%, driving down the price of micro-pitch products below P1.0 by 40%.