This article in-depth analysis of the three major packaging technology system for LED display, compare the core differences between SMD, COB, IMD, explain the key technology nodes in the packaging process, and look forward to the development trend of miniaturization and intellectualization. Through technological innovation to promote the display industry to the direction of higher resolution, better reliability.

This paper systematically analyzes the three major packaging technology routes in the field of LED display, compares the core differences between SMD, COB and IMD, reveals how the micro-miniaturization process and the application of new materials can promote the breakthrough of display performance, and looks forward to the development trend of frontier technologies such as quantum dot conversion.