This paper analyzes the principle of SMD, COB, GOB and other mainstream LED packaging technology, compares the differences in pixel density, protection level, heat dissipation performance and other key indicators of different programs, and looks forward to the development trend of Micro LED and other cutting-edge packaging technology.

This article in-depth analysis of the three major packaging technology system for LED display, compare the core differences between SMD, COB, IMD, explain the key technology nodes in the packaging process, and look forward to the development trend of miniaturization and intellectualization. Through technological innovation to promote the display industry to the direction of higher resolution, better reliability.